+
  • f5c5a57a-1b3f-4f2a-a00c-7f912c0ddf24.jpg

WC Series Wafer Dicing and Cleaning Solution

This product is primarily used for cutting various types of wafers, LEDs, silicon wafers, and ceramic substrates.
  • Commodity name: WC Series Wafer Dicing and Cleaning Solution
  • Product description
  • Product Overview:

    This product is primarily used for cutting various types of wafers, LEDs, silicon wafers, and ceramic substrates. It offers excellent lubricity and cleaning properties, quickly removing silicon dust particles generated during the cutting process and reducing scratches caused by the dust. After cutting, the silicon wafer edges are neat, smooth, and free of chipping, significantly reducing defects during the cutting process. This product is environmentally friendly and biodegradable.

    Product Description:

    1. Formulated with high-quality lubricants and surfactants, it offers excellent cooling, lubrication, powder settling, and cleaning properties;

    2. Effectively reduces water surface tension and increases conductivity, preventing silicon powder adhesion;

    3. A completely neutral product that does not affect the luster of metal components on the wafer;

    4. Reduces issues such as chipping, warping, and scratches, significantly improving product yield;

    5. Contains no toxic or irritating ingredients; the product is eco-friendly, mild, and non-irritating;

    6. Extends the service life of cutting blades and improves processing efficiency;

    The product is eco-friendly and biodegradable, poses no hazards, and waste liquid is easy to dispose of.

    II. Product Data:

    Properties

    Unit

    Data

    Appearance (Undiluted Solution)

    Transparent, slightly colored liquid

    Appearance (Diluted Solution)

    Transparent liquid

    Odor

    None

    Melting Point

    [°C]

    -5

    Kinematic viscosity

    [mm²/s, 40°C]

    7.2 ± 0.5

    Density

    [kg/m³ at 15°C]

    0.98–1.02

    pH

    6–8

    III. Product Usage:

    The dilution ratio can be achieved by first diluting the concentrate 1:6 with purified water and adding it to the pump, then using it according to the purified water injection ratio set on the mixing pump.

    Comparison Chart:

    Cutting without coolant

    cutting with coolant

    Product Packaging, Storage, and Transportation:

    Packaged in plastic drums; gallon containers available upon request

    Non-hazardous material; easy to store and transport;

    Shelf life: two years. Do not store outdoors; protect from sun and rain;

    Tighten the lid of unused cutting fluid to prevent moisture and impurities from entering.

    Shelf life: Two years

Keywords:

Get a Quote

Note: Please leave your email address, our professionals will contact you as soon as possible!