Laser Cutting Coolant

Overview of Laser Cutting:

Laser cutting involves focusing a high-energy-density laser beam near the material to be cut using a lens; when the beam strikes the material’s surface, it melts the material, thereby completing the cutting process. Materials to be cut, including ceramics, glass, wafers, silicon wafers, and IC substrates (PCBs), absorb nearly all of the laser’s energy when exposed to it. Due to their poor thermal conductivity and narrow heating zone, high thermal stress is generated along the beam’s path, causing the material to fracture easily and making it difficult to control.

Overview of Laser Cutting Protective Fluid:

To address these technical challenges, our company has developed a protective fluid for laser cutting. This product rapidly forms a protective film on the surfaces of workpieces such as wafers, silicon wafers, ceramics, and PCB substrates, effectively dissipating heat to prevent cracking, chipping, and surface scorching. It eliminates the “postage stamp” effect—where the cut surface appears uneven— leaves no slag residue on the workpiece surface, reduces thermal damage to the cut edges, improves processing quality, ensures high processing precision, produces smooth, flat, and burr-free cut surfaces with narrow kerfs, and prevents damage to the lens caused by spatter and smoke deposits.

Product Features:

● Suitable for laser grooving, cutting, or drilling processes on semiconductor wafers, silicon wafers, glass, and PCB substrates, as well as blackening processes for ceramics;

● Provides excellent heat dissipation, thermal insulation, cooling, and lubrication;

● Features anti-slag adhesion, ease of processing, ease of operation, and ease of cleaning;

● Improves cutting quality and machining precision: clean, straight edges; crack-free, smooth, and burr-free cut surfaces; minimal heat-affected zone and narrow kerf for material savings;

● Protects laser equipment lenses from damage caused by spatter;

● Environmentally friendly and non-irritating, safe for both humans and the environment.

Physical Properties:

Usage Instructions:

After evenly applying the laser protective fluid to the surface of the material to be cut using a spray or spin coater, laser cutting or drilling can begin.

After spin-coating the protective fluid, it can air-dry to form a film (4–5 hours); it can also be oven-dried to form a film. We recommend stepwise drying: 40°C for 5 minutes, followed by 65°C for 10–15 minutes.

Applications:

Wafer Slicing

Crackdown on Illegal Ceramics

PCB Cutting

Glass Drilling

Clean, straight edges

Chipped edges, cracks (unused)

Flat and smooth

Reduced heat damage

Application Scenarios:

Wafer cutting, PCB cutting, glass drilling, ceramic blackening

Clean, straight edges; minimizes chipping and cracking (when unused); smooth surface; reduces thermal damage

Product Packaging, Storage, and Transportation:

Packaged in plastic drums: available in gallon containers; custom packaging available upon request

Non-hazardous material; easy to store and transport;

Two-year shelf life; must not be stored outdoors; protect from sun and rain;

Tighten the lid on unused product to prevent moisture and impurities from entering.

Shelf life: Two years